Signal Integrity

These processes can improve signal integrity. The back-drill process, HDI stack-up, and sequential stack-up can reduce stub length or non-stub design. The panel rotation design can reduce the skew issue.

Use the low Df material can improve the insertion loss.

The NE-glass fiber can reduce the insertion loss than using the E-glass fiber.

The different stack-up in the same material will have different insertion loss results. Before the manufacture can use the simulation to know the insertion loss result.

The low Dk/Df solder mask can improve the micro-strip line insertion loss.

Measurement capability

The skin effect solution in high frequency. We have low etching treatment before lamination to improve the high-frequency insertion loss.